ShenzhenShi LvMeiJinYu Electronics Co.,Ltd
Founded in 2005 and headquartered in Shenzhen, LM devotes to technology innovation and covers industries of telecommunication,power, security, Optronics, industrial control, medical, Auto product, comsumer electronics, etc., 40% product for oversea market of South America, Europe, Japan, India, Middle East, etc..
Each year, we complete thousands of successful assignments, this volume creates market knowledge that allows us to seize opportunities, speed the business process and create the most thorough, precisely accurate picture of PCB & related industries conditions and trends.
Every day, in markets around the globe, we apply our insight, experience, intelligence and resources to help customers make informed PCB & related services/products decisions.
Different Product
1. Process capacity
2. Lead Time
3. Stack-Up
4.Product Type
If you have PCB project pls send your Gerber files and PCB specification,we will reply to you ASAP. Thank you!
Founded in 2005 and headquartered in Shenzhen, LM devotes to technology innovation and covers industries of telecommunication,power, security, Optronics, industrial control, medical, Auto product, comsumer electronics, etc., 40% product for oversea market of South America, Europe, Japan, India, Middle East, etc..
Each year, we complete thousands of successful assignments, this volume creates market knowledge that allows us to seize opportunities, speed the business process and create the most thorough, precisely accurate picture of PCB & related industries conditions and trends.
Every day, in markets around the globe, we apply our insight, experience, intelligence and resources to help customers make informed PCB & related services/products decisions.
Different Product
1. Process capacity
| Process Capability And Checking Parameters(Hard Board) | |||||||
| NO | ITEM | Technical Capabilities | |||||
| 1 | Layers | 2-58L ,68L for samples | |||||
| 2 | Max.Board Size | 1200*610mm | |||||
| 48"*24" | |||||||
| 3 | Finished Board Thickness | 0.2mm--10.0mm,17.5mm for samples | |||||
| 0.008"--0.4" | |||||||
| 4 | Finished Copper Thickness | 17um-420um | |||||
| 0.5OZ--12OZ | |||||||
| 5 | Min.Trace Width/Space | 0.075mm/0.065mm | |||||
| 0.003"/0.0026" | |||||||
| 6 | Min.Hole Size | 0.15mm | |||||
| 0.006" | |||||||
| 7 | Hole Dim. Tolerance(PTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 8 | Hole Dim.Tolerance(NPTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 9 | Drill Location Tolerance | ±0.05mm | |||||
| ±0.002" | |||||||
| 10 | V-Cut Degrees | 20-90 ºC | |||||
| 20DEG-90DEG | |||||||
| 11 | Min.V-Cut PCB Thickness | 0.4mm | |||||
| 0.016" | |||||||
| 12 | N/C Routing Tolerance | ±0.1mm | |||||
| ±0.004" | |||||||
| 13 | Min.Blind/Buried Via | 0.15mm | |||||
| 0.06" | |||||||
| 14 | Plug Hole Size | 0.2mm--0.6mm | |||||
| 0.008"--0.024" | |||||||
| 15 | Min.BGA PAD | 0.2mm | |||||
| 0.008" | |||||||
| 16 | Materials | FR4,Aluminium,High Tg,Halogen-free,Rogers,ShengYi,KB | |||||
| 17 | Surface Finish | LF-HAL,ENIG,ImAg,ImSn,OSP,Gold plating,ENIG+OSP,HAL+G/F | |||||
| 18 | Warp & Twist | ≤0.75% | |||||
| 19 | Electrical Testing | 50--300V | |||||
| 20 | Solderability Testing | 245±5ºC,3sec Wetting area least95% | |||||
| 21 | Thermal Cycling Testing | 288±5ºC,10sec,3cycles | |||||
| 22 | Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm | |||||
| 23 | Soldmask Adhesion Testing | 260ºC+/-5, 10S,3times | |||||
| Process Capability - Technical Parameters(FPC) | |||||
| Content | Common | Special | Surface treatment | Thickness | |
| Minimum line width | 0.07mm | 0.05mm | Electroplated nickel gold | Ni:3-9um;Au:0.03-0.1um | |
| Minimum line spacing | 0.07mm | 0.05mm | |||
| Minimum Drilling aperture | Φ 0.15mm | Φ 0.1mm | |||
| Aperture Tolerance | ±0.1mm | ±0.05mm | Chemical immersion gold | Ni:3-5um;Au:0.03-0.1um | |
| Maximum imposition size (single panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | |||
| Maximum imposition size (double panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | |||
| Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) | 610*1650mm | Electroplated hard gold | Ni:2-9um;Au:0.1-0.3um | ||
| Finished board impedance tolerance | ±10% | Electroplated pure tin | Sn:3-7um | ||
| Maximum production layer | 12L | ||||
| Thickness To Diameter Ratio | 2:1(Minimum aperture 0.1mm) | ||||
| 5:1(Minimum aperture 0.2mm) | Anti-oxidation | ||||
| 8:1(Minimum aperture 0.3mm) | |||||
| Monthly production capacity/m² | 16000 m² | ||||
| Material | |||||
| Substrate Material | PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) | ||||
| Conductive Medium | Copper foil(1/3oz,1/2oz,1oz,2oz) | ||||
| Constantan | |||||
| Silver Paste | |||||
| Copper Ink | |||||
| Adhesive | Epoxy resin, Acrylic, Adhesion | ||||
| Solder Mask / Protective Film | PI(0.5mil,1mil,2mil)(Yellow, White, Black) | ||||
| PET(1mil,2mil) | |||||
| Solder mask (green, yellow, black...) | |||||
| Glue | 3M467,3M468,3M9077,TESA8853... | ||||
| Reinforcement Type | PI,FR4,PET,Steel,Aluminum... | ||||
2. Lead Time
3. Stack-Up
4.Product Type
If you have PCB project pls send your Gerber files and PCB specification,we will reply to you ASAP. Thank you!